Fibics' state-of-the-art Model 250 is capable of decapsulating not only devices susceptible to nitric acid, but also more complex devices - such as ball grid array (BGA) packages that require hot (250 ºC or more) sulphuric acid etching, and special cooling during the etch cycle to prevent solder bump loss.
Our extensive experience with the Model 250 means that we offer fast turn-around times for a large range of packages. Most decapsulation jobs can be performed on a same day basis. Our professional staff is particularly knowledgeable and experienced in the decapsulation of ball grid array (BGA) packages, and multi-chip module (MCM) packages.
Contact us if you would like more information about our decapsulation services.