Fibics Pattern
Decapsulation
The industry leading B&G International Model 250 is the decapsulator of choice among large semiconductor manufacturers. Fibics has chosen the Model 250 for its versatility, and precise control of temperature and acid volume.
Repeatable, reliable decapsulation is a key first step in device modification. Our team of experts uses the Model 250 for repeatable and reliable results, attaining high success rates.
Model 250 Decapsulator
With the Model 250, the amount of acid applied during decapsulation can be controlled reproducibly to a few micro liters of volume, and the temperature can be programmed between 20 ºC and 250 ºC with an accuracy of +/- 2 ºC. This programmability combined with built-in safety features and dry nitrogen gas purging results in exact, reproducible decapsulation with a minimum amount of corrosion to your part.
Fibics' state-of-the-art Model 250 is capable of decapsulating not only devices susceptible to nitric acid, but also more complex devices - such as ball grid array (BGA) packages that require hot (250 ºC or more) sulphuric acid etching, and special cooling during the etch cycle to prevent solder bump loss.
Our extensive experience with the Model 250 means that we offer fast turn-around times for a large range of packages. Most decapsulation jobs can be performed on a same day basis. Our professional staff is particularly knowledgeable and experienced in the decapsulation of ball grid array (BGA) packages, and multi-chip module (MCM) packages.
Contact us if you would like more information about our decapsulation services.