FIB cross-section showing device modification connecting Metal 3 to Metal 1. Firstly, a 0.8 micron wide hole is drilled down to Metal 1 between two Metal 3 lines. Then a window is opened to expose the Metal 3 line. Finally the holes are filled and joined with FIB deposited tungsten.

FIB Cut to Isolate a Bond Pad. FIB precision sectioniong can accuractely and cleanly isolate a bond pad from the surrounding circuitry, as demonstrated here on a seven metal, 0.15 µm technology device.